Context:

Project ADIESSN wants to show the feasibility of advanced and efficient manufacturing resulting in strong and highly conductive interconnections of 2D and 3D structures.

The challenge:

• Connect silver sintering as interconnection technology with 3D metal printing for advanced manufacturing.
• Develop a method and materials to use silver containing filaments for 3D printing.
• Realise difficult and 3D shape structures for interconnection of wires, stamping parts.

Supplier:

https://www.nano-join.de/

User:

https://tiwari-instruments.com/